Sessions | Session Chairs |
| EUVL | BG Kim (Samsung) Britt Turkot (Intel) |
| Design Layout and Lithography Co-op | Luigi Capodieci (Motivo) David Fried (LAM) |
| Electronics and Litho Optimization | Kafai Lai (IBM) |
| Advanced Materials and Process for Litho | Pat Martin (AMAT) Jeff Smith (TEL) |
| Multi Patterning Strategies | Bernd Geh (Zeiss) Donis Flagello (Nikon) Kamal Yadav |
| Metrology and Inspection | Thomas Scheurebl (Zeiss) Sterling Watson (KT) |
| E-Beam and Mask-Making | Noriaki Nakayamada (NuFlare) Bryan Kasprowicz (Photronics) |
| Computational Litho | Danping Peng (tsmc) Martin Burkhardt (IBM) |
| Topics in Advanced Packaging and 3D Design | Ravi Mahajan (Intel) Lars Liebmann (TEL) |
| AI & Deep Learning in Litho | Mike Meyer (CDLe) Yu Cao (ASML Brion) |