Sessions | Session Chairs |
EUVL | BG Kim (Samsung) Britt Turkot (Intel) |
Design Layout and Lithography Co-op | Luigi Capodieci (Motivo) David Fried (LAM) |
Electronics and Litho Optimization | Kafai Lai (IBM) |
Advanced Materials and Process for Litho | Pat Martin (AMAT) Jeff Smith (TEL) |
Multi Patterning Strategies | Bernd Geh (Zeiss) Donis Flagello (Nikon) Kamal Yadav |
Metrology and Inspection | Thomas Scheurebl (Zeiss) Sterling Watson (KT) |
E-Beam and Mask-Making | Noriaki Nakayamada (NuFlare) Bryan Kasprowicz (Photronics) |
Computational Litho | Danping Peng (tsmc) Martin Burkhardt (IBM) |
Topics in Advanced Packaging and 3D Design | Ravi Mahajan (Intel) Lars Liebmann (TEL) |
AI & Deep Learning in Litho | Mike Meyer (CDLe) Yu Cao (ASML Brion) |