Speakers

PresenterAffiliationTitle of the Presentation
Patrick SchiavoneAselta
Daan SlotboomASMLEUV-DUV matching in a world of 2nm overlay
Jo FindersASML
Yi Zou (accepted)ASML
Stephen HsuASML/Brion
Ofir SharoniCarl Zeiss Ltd. Bar lev, ILImproving Chip Performance by Photomask Tuning: Ultimate intra-field CD control as a major part of an overall excursion prevention strategy
Benjamin VincentCoventorAssessment of multi-patterning integration options using Virtual Fabrication
Naoya HashiDNP
Paul SchroederGlobalFoundries
Allen GaborIBM
Kurt RonseIMEC
Julien RyckaertImecScaling solutions in the 3rd dimension
Andrew GrenvilleInpria
Mark PhilipsIntel
Richard ShenkerIntel
Robert BristolIntelStochastics everywhere, from the incoming photon to the final edge
Frank AbboudIntel
Vivek SinghIntel
Apo SezginerKLA
John BiaforeKLA
David FriedLAM
Rich WiseLAM
Peter BuckMentor
Michael LamMentor
Amy WeatherlyMicron
Stephen RenwickNikon
John HunVidia
Chris Progler PhotronicsIs perfection the new standard for intermask effects in advanced lithography ?
Henry KamberianPhotronicsEUV Mask Technology: Challenges and Opportunities on the Path to N3 Requirements
Mike Green Photronics/IBMAdvanced modeling techniques for mask process development and verification
Seong-Sue KimSamsung
Changmoon LimSK-Hynix
Bala ThummaSynopsys
Peng LiuSynopsys
Toshi NishigakiTEL
Daniel Chanemougame TELDevices and cell architectures in 3D
Shigeki Nojima (pending)Toshiba
Dr. Tetsuo Nakasugi Toshiba Memory
RG LiuTSMC
Kenji YamazoeTSMC
Danping PengTSMC
Andy NeureutherUC BerkeleyTopics in EUV simulations (Student work and Thoughts on EUV Stochastics)
Prof Jiann-Shiun (Peter) YuanUCFAI for 3D Design - 3D Design for AI
David Pan (declined)UT Austin
Toshiyuki HisamuraXilinx
Bill Chen
Prof Bakir
Prof Swaminathan
Prof Subbarayan
A. Olofsson
P. Jeffery UngarD2S, Inc.