Speakers

Plenary Speakers
Jos Benschop, ASML
Winfried Kaiser, Zeiss
Scotten Jones, IC Knowledge
Ravi Mahajan, Intel
Presenter; AffiliationTitle
John Petersen, IMECIntroduction to imec’s AttoLab for ultrafast Kinetics of EUV Exposure Processes and ultra-small Pitch Lithography
Naoya Hayashi, DNPMulti-beam Technology for Advanced Mask Patterning
P. Jeffery Ungar, D2S
John Hu, NvidiaAn Intelligent Photon for the IC Industry - GPU AI Hardware for Deep Learning Applications
Vidya Vaenkatesan, ASMLLocal Errors on EUV Mask and its Impact on Wafer
Kenji Yamazoe, TSMC
Noriaki Nakayamada, NuFlareProposal of a new data format for multibeam mask writer with curve expression
Hiroki Miyai, LasertecMask-inspection simulation
Soo-Ryong Lee, SamsungAI Driven Computational Patterning for High Fidelity Si Prediction
Yuri Granik, MentorOPC for Multi-patterning
Shashank Ekbote, QualcommAutomotive application (TBD)
Prof Jiann-Shiun (Peter) Yuan, UCFMachine Learning Enhanced Place-and-Route of 3D Process-in-Memory Accelerators
Rahul Lakwawat, KLA/IMECOptical Inspection for EUV ADI Defectivity
Andy Neureuther, UC BerkeleyTopics in EUV simulations (Student work and Thoughts on EUV Stochastics)
B G Kim, E-SOL
Robert Bristol, IntelStochastics everywhere, from the incoming photon to the final edge
Leo Pang, D2SMaking Digital Twins using the Deep Learning Kit (DLK)
Stephen Renwick, NikonA Funny Thing Happened on the Way to 5nm
Daniel Chanemougame, TELDevices and cell architectures in 3D
Oliver Patterson, HMIEdge Placement Error Measurement using Voltage Contrast Test Structures
David Fried, LAMTechnology Scaling through Variation Reduction
James Shiely, Synopsys
Nelson Felix, IBMThe Evolution of Patterning Challenges from High-Performance Computing to AI Applications
Ingo Schulmeyer, Carl ZeissCorrected Low Voltage SEM for Metrology and Analytics
Vito Dai, MotivoAdvanced Layout Analytics: from Geometric Features to Network Graph Features
Mike Green, IBM Advanced modeling techniques for mask process development and verification
Stacey Bent, StanfordArea Selective Atomic Layer Deposition for Advanced Patterning
Michael Yeung, FastLithoUse of GPU accelerated Maxwell solver in rigorous lithography and
Chris (James) Taylor, DowLitho material technology beyond conventional
semiconductor microlithography
Yi Zou, BrionOptimizing Overlay using Machine Learning on Combined Lithography and Non-lithography Data
Tetsuo Nakasugi, Toshiba The future of NIL: enabling a new semiconductor manufacturing
Chris Progler, PhotronicsIs perfection the new standard for intermask effects in advanced lithography ?
Brian Cline, ARMDTCO in 2019: The Precious Metal Stack and the Route to Better Designs
Chris Mack, FractiliaMetrology for Roughness and Stochastic Variability Measurements and Why it is Essential for Making EUV Successful
Yuki Watanabe, Toshiba
Daan Slotboom, ASMLEUV-DUV matching in a world of 2nm overlay
Toshiyuki Hisamura, XilinxACAP – Adaptive Compute Acceleration Platform and the Lithography needs
Tom Pistor, PanaramicEnabling novel DFM applications with a fast FullChip lithography simulator
Peng Liu, Synopsys
Martin Burkhardt, IBMInvestigation of mask absorber induced image shift in EUV lithography
Yuichiro Yamazaki, NGRPattern Fidelity Mass-Metrology for EUV Era
Doug Resnick, CanonEUV-DUV matching in a world of 2nm overlay
Clemens Utzny, AMTCApplication of Machine Learning Methods to Lithographic Problems
Benjamin Vincent, CoventorAssessment of multi-patterning integration options using Virtual Fabrication
Peter Buck, MentorMachine Learning Guided Curvilinear MPC
Andreas Erdmann3D Mask Effects in High NA EUV
Julien Ryckaert, IMECScaling solutions in the 3rd dimension
Henry Kamberian, PhotronicsEUV Mask Technology: Challenges and Opportunities on the Path to N3 Requirements
J. Alexander Liddle, NISTDNA origami, a bottom-up approach
John Randall, Zyvex LabA high resolution e-beam
Yuhang Zhao, CTO of Huahong
Alex Tritchkov, MentorUse of native objective functions in pixel-based mask optimization
Paul Schroeder, GF
Siva Kanakasabapathy, LAM
Jeffrey Smith, TEL
Takahiro Mori, Mitsubishi ChemicalAquaSAVETM Antistatic Agent for Electron Beam Lithography
Ofir Sharoni, Carl ZeissImproving Chip Performance by Photomask Tuning: Ultimate intra-field CD control as a major part of an overall excursion prevention strategy
Niels Wijnaendts van Resandt, HeidelbergTechnology challenges in industrial high speed direct write lithography
Juhao Wu, SLAC
Derren Dunn, IBM
Ric Borges, Synopsys
Vikram Tolani, KLAComputational Patterning Prediction of Defect Printability in EUV
Regina Freed, Applied MaterialsMaterials Based Patterning
Ivan Ciofi, IMECImpact of litho-patterning variations on electrical performance, variability and reliability
Stephen Hsu, ASML/BrionEUV Imaging optimization to reduce the impact of Aberration