Topics and Topical Chairs

Sessions

Session Chairs

EUVL BG Kim (Samsung)
Britt Turkot (Intel)
Design Layout and Lithography Co-op Luigi Capodieci (Motivo)
David Fried (LAM)
Electronics and Litho Optimization Kafai Lai (IBM)
Da Yang (TEL)
Advanced Materials and Process for Litho Pat Martin (AMAT)
Jeff Smith (TEL)
Multi Patterning Strategies Bernd Geh (Zeiss)
Donis Flagello (Nikon)
Metrology and Inspection Thomas Scheurebl (Zeiss)
Sterling Watson (KT)
E-Beam and Mask-Making Noriaki Nakayamada (NuFlare)
Bryan Kasprowicz (Photronics)
Computational Litho Danping Peng (tsmc)
Martin Burkhardt (IBM)
Topics in Advanced Packaging and 3D Design Ravi Mahajan (Intel)
Lars Liebmann (TEL)
AI & Deep Learning in Litho Mike Meyer (CDLe)
Yu Cao (ASML Brion)